Products & technology
Enhance liquid cooling with stably suspended nanoencapsulated microcapsules, and buffer heat peaks and cooling transitions with conductive, high-enthalpy UltraST storage. Combine continuous heat transport with short-term cooling reserves.
Products we supply
Functional microcapsules for liquid cooling
Stably suspended microcapsules bring latent heat into the coolant, increasing heat-carrying and temperature-buffering capability; dispersion stability is checked after circulation.
Nanoencapsulated microcapsules and dispersion development for coolants and cooling loops.
Product detailsUltraST cooling plates and cores
A three-dimensional graphite network transfers heat into PCM. High enthalpy provides transient storage, working with the heat-exchange interface to buffer rising loads.
PCM and plate assemblies selected for supply/return temperatures, release power and space.
Product detailsCooling modules and cabins
Low supercooling and cycling stability support repeatable capacity recovery, making stored cooling available during a cooling-source transition.
Cores, heat-exchange interfaces and cabins sized for the required buffer duration.
Product detailsNANOENCAPSULATED PCM / LIQUID COOLING
Nanoencapsulation forms PCM microcapsules; dispersion design keeps them stably suspended. The coolant can transport heat and provide phase-change buffering, alongside an UltraST storage branch.
Design particle size, shell and dispersion together. Assess settling, redispersion and distribution after circulation so microcapsules remain available for heat transport.
The shell confines the PCM core. Evaluate shell integrity and performance retention under pump shear, thermal cycling and contact with equipment materials.
The core absorbs latent heat within its transition range, increasing heat-carrying and buffering capacity there. System improvement also depends on flow, heat exchangers and pump energy.
Conceptual system; interfaces are matched to equipment. Assess added latent capacity separately from system cooling performance, including pressure drop, pump energy, compatibility and circulation stability.
Discuss liquid-cooling materials and validationULTRAST + NANOENCAPSULATED PCM
Combine continuous coolant heat transport with transient PCM storage to size cooling reserves around compute-load changes.
01 / Stable suspension for circulating coolants
Nanoencapsulation and dispersion design keep PCM microcapsules stably distributed in liquid for circulating heat transport.
Data and validation basisMaterial validation: settling, particle distribution and stability after circulation
02 / Encapsulation reliability for real use
Assess shell integrity, core retention and interface compatibility, then recheck after the actual process or operating cycle.
Data and validation basisLoop validation: shell integrity, pressure drop, pump energy and compatibility
03 / High conductivity: move heat into PCM faster
A continuous three-dimensional graphite network provides heat paths and reduces internal heat-transfer bottlenecks in UltraST.
Data and validation basisHeat-exchange validation: discharge power at specified flow and temperature difference
04 / High enthalpy: store heat within limited space
Latent heat stores energy within the selected transition range; usable capacity follows the effective PCM content of the finished product.
Data and validation basisProduct parameter: latent capacity; system design: usable buffer duration
05 / Stable cycling: recover capacity repeatedly
Confinement limits component migration and phase separation to support thermal performance over repeated charge/discharge cycles.
Data and validation basisDurability validation: enthalpy, transition range and power after cycling
06 / Flame retardancy for safer integration
Flame-retardant selected UltraST formulations work with encapsulation; combustion performance is assessed for the material and finished product.
Data and validation basisTest documentation: combustion performance of the selected UltraST formulation and product
UltraST targets high conductivity and enthalpy, low supercooling and stable cycling, with shape-stable leak-resistant design and flame-retardant selected formulations. Metrics apply to the selected formulation, temperature range and product; microcapsules are assessed for their own materials and processes.
PCM plates and cores in a cooling loop, connected through heat exchange interfaces.
Charge the PCM buffer while cooling is available.
Use stored cooling during a transition or rising heat load to provide a limited recovery buffer.
Recharge after cooling returns. Capacity for the next event depends on the actual charge state.
EXPLORE FURTHER
Performance and available capacity depend on the product, operating conditions and validation.
Specify Passive Edge materials into your own thermal subsystem. Use UltraST PCM as the storage medium and nano-coolant additives to lift conductivity of working fluid.
Pre-engineered modules built around UltraST cores, with integration interfaces matched to typical liquid-cooling and rear-door heat-exchanger topologies. Validated per project.
Charge the PCM buffer while cooling is available.
Use stored cooling during a transition or rising heat load to provide a limited recovery buffer.
Recharge after cooling returns. Capacity for the next event depends on the actual charge state.
Structures and cycles illustrate the principle. Selection, capacity and performance depend on operating conditions and validation.
Discuss this application
Supply and return temperatures, peak load, buffer duration and available space.