Products & technology
MOF-catalyzed transient encapsulation turns PCM cores into dispersible, processable microcapsules. Bring latent-heat buffering into fibres, coatings and foams while developing the feel and durability of the finished product.
Products we supply
PCM microcapsules
The core–shell structure confines PCM and reduces migration, allowing thermal-buffering material to be distributed within fibres, finishes or foam.
Core, shell, particle size and loading selected around the comfort-temperature range.
Product detailsDispersion and processing adaptation
Particle size, dispersion and loading are developed together to balance latent capacity, softness and the processing needs of each substrate.
Sample development for spinning, finishing, foaming and composite processes.
Product detailsFinished-product thermal and durability validation
Compare latent-heat retention, core migration and feel before and after processing and washing to define repeatable finished-product performance.
Thermal cycling, washing and post-processing assessment for the intended use.
Product detailsMICROENCAPSULATION
Focus on processing, dispersion and performance after use to build thermal function into flexible substrates.
01 / Microencapsulation for substrate integration
MOF-catalyzed transient encapsulation forms a core–shell structure; particle size and loading are adapted to fibres, coatings, foams and elastomers.
Data and validation basisMaterial parameters: particle distribution, core loading and dispersion
02 / High enthalpy: store heat within limited space
Latent heat stores energy within the selected transition range; usable capacity follows the effective PCM content of the finished product.
Data and validation basisFinished-product validation: enthalpy per mass/area and temperature response
03 / Encapsulation reliability for real use
Assess shell integrity, core retention and interface compatibility, then recheck after the actual process or operating cycle.
Data and validation basisProcess validation: shell integrity, core migration and feel
04 / Microcapsule durability: retain shell integrity and latent heat
The core–shell structure confines PCM. Validate shell integrity, core retention and latent performance after thermal cycling and washing of the finished product.
Data and validation basisDurability: agreed wash count, thermal cycles and retained enthalpy
Microencapsulated PCM in finishes, composite fiber layers or foam substrates.
Suitable temperatures prepare the phase change core to absorb heat.
Within its working range, the core absorbs some heat and provides temporary temperature buffering.
Cooling releases stored heat. Performance must be validated against loading, substrate and test method.
EXPLORE FURTHER
Performance and available capacity depend on the product, operating conditions and validation.
A PCM core sealed in a robust shell down to 200 nm. It melts and re-freezes at the comfort point without ever leaking into the fibre.
Capsules are spun into the fibre or bonded as a finish — distributing capacity through the whole cloth, not just on the surface.
Woven or knitted into bedding, apparel, and throws — soft hand-feel, machine-washable, with thermal buffering built into the cloth itself.
Quilts, pillow covers, and mattress toppers that pull the warm peak off the body at sleep onset — for a cooler, steadier night without dropping the room temperature.
The PCM control throw — a soft blanket with embedded latent capacity that holds a comfortable contact temperature on the sofa or in bed.
PCM yarn and coated finishes supplied to apparel and home-textile makers — for shirts, linings, and activewear that smooth the skin microclimate.
Suitable temperatures prepare the phase change core to absorb heat.
Within its working range, the core absorbs some heat and provides temporary temperature buffering.
Cooling releases stored heat. Performance must be validated against loading, substrate and test method.
Structures and cycles illustrate the principle. Selection, capacity and performance depend on operating conditions and validation.
Discuss this application
Substrate, desired thermal feel, processing conditions and durability requirements.