Electronic thermal management Layer 01 · Material

Hold silicon in its safe band — passively.

Nano PCM, PCM rubber, and high-conductivity solid-state PCM sit at the heat source — chips, power-battery packs, motor drives — absorbing the thermal peak as latent heat and releasing it slowly. Zero added energy, no fans, no throttling cliff.

Material
Nano PCM · PCM rubber · Solid-state PCM
Phase point
Tunable 30–65 °C (custom outside)
Conductivity
Up to 20 W/(m·K) graphite-matrix
Outcome
Peak shaving · Cycle life · Quiet, passive
Render · nano PCM microcapsules buffering a junction hotspot
01Why silicon overheats
02Material / Form factor
03Where it goes
04Field case
05Validation & review
01 / Why silicon overheats

Heat arrives in bursts. Cooling reacts too slowly.

1. Transient peaks throttle performance. A chip or motor drive doesn’t run at steady power — it spikes. Fans and heat sinks respond on a slow time constant, so the junction hits its limit and the device down-clocks before the cooling catches up.

2. Confined devices have nowhere to dump heat. Phones, tablets, robot vacuums, and compact power tools have no room for active cooling. Heat builds at the source and the whole enclosure climbs.

3. Battery life pays the price. Lithium cells age fastest when they run hot and unevenly. Every degree above the comfortable band, and every thermal gradient across the pack, costs cycles.

A phase-change layer sitting at the heat source absorbs the burst as latent heat — holding temperature flat through the transition, then bleeding it back out slowly once the load drops. It buys the slow cooling path time to keep up.

Representative junction response

Junction temperature under a burst load — with and without a PCM buffer layer
THROTTLE LIMIT (Tj,max) warm band cool HELD IN BAND load on peak recovery
No buffer — junction crosses Tj,max With PCM buffer — held in band
02 / Material & form factor

Two ways to put PCM at the source.

Whether you need a conformable pad that drops into an existing stack-up, or a high-conductivity solid block that doubles as a heat spreader — both deliver latent buffering exactly where the heat is.

— Conformable option

PCM rubber gap pad

EDGE Microna-PCM microcapsules (down to ~300 nm) compounded into an elastomer. Leak-free through the phase transition, it conforms to uneven surfaces and fills the gap between die and enclosure.

  • PHASE POINTTunable 30–65 °C
  • FORMSheet · die-cut pad · molded part
  • SEALINGMicroencapsulated — no leakage on melt
  • FIT FORPhones, tablets, robot vacuums, power tools
— High-conductivity option

Solid-state PCM heat block

PASSIVE EDGE® graphite-matrix solid-state PCM — up to 20 W/(m·K) and rated for 20,000+ cycles. The graphite skeleton pulls heat in fast and spreads it evenly, so the latent capacity charges and discharges quickly.

  • CONDUCTIVITYUp to 20 W/(m·K)
  • CYCLE LIFE20,000+ charge / discharge cycles
  • FORMMachined block · plate · custom geometry
  • FIT FOREV battery packs, motor drives, modules
03 / Where it goes

From the die to the pack.

The same material platform scales across form factors — wherever a hotspot needs to be held flat without spending energy on it.

— Chip / SoC

Phone & tablet chips

A thin PCM pad over the SoC absorbs sustained-load bursts so the phone holds performance longer before it throttles.

— Longer sustained performance
— Power battery

EV & e-mobility packs

Solid-state PCM between cells evens out the pack’s temperature gradient and caps the peak during fast charge and high draw.

— Even pack · more cycles
— Robot vacuum

Robot vacuums

PCM rubber wrapped around the battery gives the cells zero-energy temperature control through dock-and-run cycles. Deployed in a Mijia-ecosystem unit.

— +40% battery cycle life
— Devices

Power tools & modules

Motor drives, fast chargers, and outdoor power gear that run in bursts — PCM blocks soak the duty-cycle peak so the electronics stay in band.

— Quiet, fan-free margin
04 / Field case · robot vacuum

Zero-energy battery control in a robot vacuum.

A robot vacuum’s lithium pack charges hard at the dock and discharges hard on the floor — a punishing thermal cycle in a sealed body with no room for active cooling.

Wrapping the cells in PCM rubber holds the pack inside its safe band and evens out the temperature across cells — with no added energy and no moving parts. The result was a markedly longer-lived battery and a longer service life for the machine.

+40%
Battery cycle life vs. baseline pack
0W
Added energy — fully passive control
~300nm
Minimum microcapsule size, leak-free
20k×
Rated charge / discharge cycles
05 / What we need to assess fit

Tell us about the hotspot.

The more of the following you can share early, the faster we can return a useful response. None of these constitute a commitment from either side.

— Heat source
Device / component, peak & average power, duty cycle, burst duration.
— Temperature targets
Tj,max or cell limit, target hold band, ambient envelope.
— Stack-up & space
Available thickness, contact area, surface flatness, existing heat path.
— Form constraints
Pad vs. block, conformability, weight budget, dielectric needs.
— Reliability
Cycle count, shock / vibration, flammability rating, lifetime target.
— Stage & volume
Prototype vs. production, annual volume, qualification timeline.
06 / Calculation tool

Size the latent buffer for your duty cycle.

The Thermal Sizing Tool estimates how much latent capacity a given hotspot needs to stay in band across a burst load. Outputs are directional — final design depends on bench validation against your stack-up.

07 / Validation & review path

From hotspot to qualified part.

We work in clearly-bounded stages. No stage commits the next. Each produces something you can use internally — even if you don’t proceed with us.

— 01

Thermal profile submitted

You share power, duty cycle, temperature limits, and stack-up. We return a written fit assessment within ~5 business days.

— 02

Material & form selection

Joint review of phase point, conductivity, and form factor — pad vs. solid block — with predicted hold-band performance.

— 03

Bench sample

A sample part on a representative thermal load, instrumented for junction / cell temperature against your limit.

— 04

Qualification

Cycle, reliability, and integration testing against measured data. Decisions to scale are made on evidence, not promises.

Request a Thermal Review Submit a thermal profile
08 / Technical resources

Build your internal case.

Get in touch

Share your power profile, temperature limit, and stack-up.

Our team will respond with a fit assessment, the relevant material data package, and a proposed bench test if there is a match.