Products & technology
Enhance liquid cooling with stably suspended nanoencapsulated microcapsules, fit interfaces with flexible PCM pads, and absorb transient peaks with conductive UltraST blocks. Choose a material route for sustained cooling and pulsed loads.
Products we supply
Functional microcapsules for liquid cooling
Microcapsules bring latent buffering into flowing liquid; stable suspension supports circulation. Validate heat transfer, pressure drop and pump energy in the actual loop.
Nanoencapsulated microcapsules and dispersion development for electronic cooling fluids.
Product detailsFlexible PCM pads and composites
The shell confines the PCM core while the flexible substrate fits uneven surfaces, allowing limited gaps to contribute transient thermal buffering.
Microcapsules in elastomers for sheets, die-cut parts and conformable interfaces.
Product detailsUltraST shape-stable thermal blocks
Graphite transfers heat rapidly, a high-enthalpy core absorbs peaks, and shape-stable leak-resistant design supports compact integration. Existing cooling paths restore capacity at low load.
Blocks and plates developed for source geometry, power profiles and heat-exchange interfaces.
Product detailsNANOENCAPSULATED PCM / LIQUID COOLING
Nanoencapsulation forms PCM microcapsules; dispersion design keeps them stably suspended. The coolant can transport heat and provide phase-change buffering, alongside an UltraST storage branch.
Design particle size, shell and dispersion together. Assess settling, redispersion and distribution after circulation so microcapsules remain available for heat transport.
The shell confines the PCM core. Evaluate shell integrity and performance retention under pump shear, thermal cycling and contact with equipment materials.
The core absorbs latent heat within its transition range, increasing heat-carrying and buffering capacity there. System improvement also depends on flow, heat exchangers and pump energy.
Conceptual system; interfaces are matched to equipment. Assess added latent capacity separately from system cooling performance, including pressure drop, pump energy, compatibility and circulation stability.
Discuss liquid-cooling materials and validationULTRAST + NANOENCAPSULATED PCM
Coolant, conformable layers and stable blocks address continuous heat transport, interfaces and transient peaks respectively.
01 / Stable suspension for circulating coolants
Nanoencapsulation and dispersion design keep PCM microcapsules stably distributed in liquid for circulating heat transport.
Data and validation basisLoop validation: flow, temperature rise, pressure drop, pump energy and suspension
02 / Flame retardancy for safer integration
Flame-retardant selected UltraST formulations work with encapsulation; combustion performance is assessed for the material and finished product.
Data and validation basisTest documentation: combustion performance of the UltraST formulation and finished thermal block
03 / Microencapsulation for substrate integration
MOF-catalyzed transient encapsulation forms a core–shell structure; particle size and loading are adapted to fibres, coatings, foams and elastomers.
Data and validation basisComponent validation: thickness, compression, contact resistance and processed enthalpy
04 / High conductivity: move heat into PCM faster
A continuous three-dimensional graphite network provides heat paths and reduces internal heat-transfer bottlenecks in UltraST.
Data and validation basisMaterial/component validation: direction of conductivity, contact and transient rise
05 / Shape-stable, leak-resistant design
Pore confinement and the composite skeleton hold the PCM core, reducing migration and liquid-leakage pathways after melting.
Data and validation basisComponent validation: post-cycle shape, encapsulation and electrical isolation
06 / High enthalpy: store heat within limited space
Latent heat stores energy within the selected transition range; usable capacity follows the effective PCM content of the finished product.
Data and validation basisDevice validation: peak temperature, buffer time and recovery at low load
UltraST targets high conductivity and enthalpy, low supercooling and stable cycling, with shape-stable leak-resistant design and flame-retardant selected formulations. Metrics apply to the selected formulation, temperature range and product; microcapsules are assessed for their own materials and processes.
A PCM buffering layer near the heat source, working with the heat dissipation structure.
During lower loads, suitable heat dissipation conditions prepare PCM for the next event.
During a brief power increase, PCM absorbs some heat and buffers device temperature changes.
Heat leaves through the existing dissipation path. Continuous cooling remains part of the overall thermal design.
EXPLORE FURTHER
Performance and available capacity depend on the product, operating conditions and validation.
EDGE Microna-PCM microcapsules (down to 200 nm) compounded into an elastomer. Leak-free through the phase transition, it conforms to uneven surfaces and fills the gap between die and enclosure.
PASSIVE EDGE® graphite-matrix shape-stabilized PCM — up to 20 W/(m·K) and rated for 20,000+ cycles. The graphite skeleton pulls heat in fast and spreads it evenly, so the latent capacity charges and discharges quickly.
A thin PCM pad over the SoC absorbs sustained-load bursts so the phone holds performance longer before it throttles.
Shape-stabilized PCM between cells evens out the pack’s temperature gradient and caps the peak during fast charge and high draw.
PCM rubber wrapped around the battery gives the cells zero-energy temperature control through dock-and-run cycles. Deployed in a Mijia-ecosystem unit.
Motor drives, fast chargers, and outdoor power gear that run in bursts — PCM blocks soak the duty-cycle peak so the electronics stay in band.
A robot vacuum’s lithium pack charges hard at the dock and discharges hard on the floor — a punishing thermal cycle in a sealed body with no room for active cooling.
Wrapping the cells in PCM rubber holds the pack inside its safe band and evens out the temperature across cells — with no added energy and no moving parts. The result was a markedly longer-lived battery and a longer service life for the machine.
During lower loads, suitable heat dissipation conditions prepare PCM for the next event.
During a brief power increase, PCM absorbs some heat and buffers device temperature changes.
Heat leaves through the existing dissipation path. Continuous cooling remains part of the overall thermal design.
Structures and cycles illustrate the principle. Selection, capacity and performance depend on operating conditions and validation.
Discuss this application
Peak power, duty cycle, temperature limit and stack space.